Semiconductor Packaging Assembly Technology
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چکیده
This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes (Table 1) are covered in this chapter: 1) plastic leadframe-based packages, 2) plastic ball grid array (PBGA), and 3) hermetic packages.
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